野村 方哉

京都府
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野村 方哉

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Ambition

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未来

Experience and education

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Skills

  • Alibre Design

    0

  • SOLIDWORKS

    0

  • ProEngineer

    0

  • 旋盤・フライス盤・ボール盤・コンター・グラインダーなどの機械加工技術

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  • 機械設計

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  • 装具開発, 知的財産管理, NC加工(MDX-5000R) and 3 skills

Accomplishments / Portfolio

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