What we do
STATS ChipPAC is a leading provider of advanced semiconductor packaging and test services to global customers in the communication, consumer and computing markets. With a broad technology portfolio ranging from leadframe and laminate packages to advanced fan-out and fan-in wafer level technology, flip chip interconnect, System-in-Package (SiP), Through Silicon Via (TSV) and 2.5D/3D packaging, STATS ChipPAC provides customers with innovative and cost-effective semiconductor solutions. STATS ChipPAC differentiates itself through innovative packaging solutions in embedded Wafer Level Ball Grid Array (eWLB), encapsulated Wafer Level Chip Scale Packaging (eWLCSP) and fcCuBE® technology as well as our breakthrough wafer level manufacturing method known as FlexLine.
Why we do
Our Vision:
To be the perimeter packaging, test and back end supply chain solutions provider delivering best in class service in our chosen markets.
Our Mission:
Our mission is to deliver differentiating backend solutions to our customers in our chosen markets through leadership in innovative advanced packaging solution, world class operational excellence, cost competitiveness, and efficient and reliable supply chain solutions.
How we do
Customer focus:
We owe our business to our customers. We strive to meet and exceed our customers' expectations at all times. We understand our customers priorities and deliver to our commitments.
Integrity:
We mean what we say and say what we mean. We establish relationship of trust, honesty and sincerity with people we deal with.
Teamwork:
We collectively work as a team, bringing our individual talent, experience and expertise to achieve common goals.
Ownership:
We are owners of STATS ChipPAC. We own our responsibilities and are accountable for our actions.
Passion to win:
We never give up till we succeed. We will strive to excel in everything we do and persevere till we do.
